1/4 rev. a structure silicon monolithic integrated circuit product series motor driver for ink jet printer (h-bridge driver 2ch, switching regulator 1ch, reset output) type BD64560EUV function ? external reset input terminal function ? built-in thermal shut down circuit ? built-in uvlo circuit absolute maximum ratings (ta=25 ) parameter symbol limit unit supply voltage v m -0.4 40.0 v logic input voltage v l -0.4 5.5 v rnf voltage (dc) v rnf (dc) 0.5 v power dissipation pd 1.70 1 w 4.32 2 operating temperature range t opt -25 +85 storage temperature range t stg -55 +150 junction temperature t jmax 150 motor driver maximum output current (peak500ns) i out (peak) 8.0 a motor driver maximum output current (dc) i out (dc) 2.5 3 a switching reg maximum output current (dc) i out 1.5 a 1 70mm 70mm 1.6mm glass epoxy board. derating in done at 13.6mw/ for operating above ta=25 . 2 4-layer recommended board. derating in done at 34.6mw/ for operating above ta=25 . 3 do not, however exceed pd, aso and tjmax=150 . recommended operating conditions (ta= -25 +85 ) parameter symbol limit unit supply voltage v m 7 36 v clk input frequency f clk 1 25 mhz switching reg output voltage range v out 1 v m 0.5 v this product isn't designed for protection against radioactive rays. status of this document the japanese version of this docume nt is the formal specification. a customer may use this translation version only fo r a reference to help reading the formal version. if there are any differences in translation version of this document, formal version takes priority.
2/4 rev. a electrical characteristics (unless otherwise specified, ta=25 , v =32v) parameter symbol limit unit conditions min. typ. max. overall vm current 1 i m1 - - 2 ma sleep=l swreg=off vm current 2 i m2 - - 15 ma sleep=h swreg=max duty control logic (c_select, irt, sleep, strobe/enable_a, clk/phase_a, data/phase_b, enable_b) high input voltage v linh 2.0 - 5.5 v low input voltage v linl 0 - 0.8 v input current i lin 15 33 50 ua input voltage=3.3v c_select low input voltage v csell 0 - 0.8 v c_select middle input voltage v cselm 1.20 1.65 2.10 v c_select high input voltage v cselh 2.5 3.3 - v c_select input current i csel -45 -33 -21 ua c_select=0v irt high input voltage v irth 2.0 - 5.5 v irt low input voltage v irtl 0 - 0.8 v irt input current i irt -50 -33 -15 ua irt=0v h bridge output on resistance (high side) r onh - 0.70 0.84 i out =1a output on resistance (low side) r onl - 0.50 0.60 i out =1a output leak current (high side) i leakh -1 - 1 ua v m =40v outxx=0v output leak current (low side) i leakl -1 - 1 ua v m =outxx=40v rnf pin outflow current i rnf 10 20 30 ua vref-rnf offset voltage v ofst -5 0 5 % vref=2v gain=1/10 or 1/20 v ofst ={(vref gain rnf threshold voltage) / (vref gain)} 100% vref voltage range v vref 0.8 - 3.0 v vref pin outflow current i vref -1 0 1 ua vref=2v high motor uvlo voltage v uvloh 13.5 15.0 16.5 v low motor uvlo voltage v uvlol 12.5 14.0 15.5 v switching regulator fb threshold voltage v fb 0.873 0.900 0.927 v fb pin outflow current i fb -1 0 1 ua output on resistance r onsw - 0.70 0.84 i out =0.5a leak current i leaksw -1 0 1 ua v m =40v swout=0v fb over voltage protection v fbovp 1.10 1.20 1.30 v disabled at turn on fb under voltage protection v fbuvp 0.55 0.60 0.65 v disabled at turn on ort pin output voltage v ort - - 0.4 v i drain =5ma leak current i leakort -1 0 1 ua vm threshold voltage v por 5.9 6.3 6.7 v no hysteresis l_out pin output voltage v lout - - 0.5 v i drain =5ma leak current i leaklout -1 0 1 ua
3/4 rev. a package outline block diagram pin no. / pin name pin no. pin name pin no. pin name 1 lgnd 48 test2 2 c_select 47 nc 3 cc 46 test1 4 irt 45 nc 5 ort 44 vmsw 6 vrefa 43 vmsw 7 vrefb 42 nc 8 sleep 41 swout 9 strobe /enable_a 40 nc 10 clk /phase_a 39 fb 11 data /phase_b 38 agnd 12 enable_b 37 nc 13 l_out 36 nc 14 tjmon 35 vm 15 nc 34 nc 16 outam 33 outbm 17 nc 32 nc 18 vma 31 vmb 19 vma 30 vmb 20 nc 29 nc 21 rnfa 28 rnfb 22 rnfa 27 rnfb 23 nc 26 nc 24 outap 25 outbp nc non connection BD64560EUV lot no. product no. htssop-c48 (unit:mm) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 swreg bch h-bridge ach h-bridge 3.3v (internal regulator) logic input control logic 5 osc por vref vref vref c_select
4/4 rev. a operation notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temper ature range of operating conditions, etc., can break down the devices, thus ma king impossible to identify breaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) power supply lines as return of current regenerated by back emf of mo tor happens, take steps such as putting capacitor between power supply and gnd as an electric pathway for the regenerated current. be sure that there is no problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. if the connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. it is recommended to implement a physical safety measure such as the in sertion of a voltage clamp diode between the power supply and gnd pins. (3) gnd potential the potential of gnd pin must be minimu m potential in all operating conditions. (4) metal on the backside (define the side wher e product markings are printed as front) the metal on the backside is shorted wi th the backside of ic chip therefor e it should be c onnected to gnd. be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than gnd. (5) thermal design use a thermal design that allows for a sufficient marg in in light of the power dissipation (pd) in actual operating conditions. this ic exposes its frame of the backside of package. note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency . try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. (6) actions in strong electromagnetic field use caution when using the ic in t he presence of a strong electromagnet ic field as doing so may cause the ic to malfunction. (7) aso when using the ic, set the output transistor so that it does not exceed absolute maximum ratings or aso. (8) thermal shutdown circuit the ic has a built-in thermal shutdown circuit (tsd circuit). if the chip temperature becomes tjmax=150 , and higher, coil output to the motor and regulator out put will be off, and reset output will be l. the tsd circuit is designed only to shut the ic off to prevent runaway thermal operation. it is not designed to protect or indemnify peripheral equipment. do not use the tsd function to protect peripheral equipment. (9) ground wiring pattern when using both large current and small signal gnd pa tterns, it is recommended to isolate the two ground patterns, placing a single ground poi nt at the ground potent ial of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. (10) test pin be sure to leave test1 pin open and connect test2 pin to gnd.
appendix-rev4.0 thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact your nearest sales office. rohm customer support system the americas / europe / asia / japan contact us : webmaster@ rohm.co. jp www.rohm.com copyright ? 2009 rohm co.,ltd. 21 saiin mizosaki- cho, ukyo-ku, kyoto 615-8585, japan tel : +81-75-311-2121 fax : +81-75-315-0172 appendix notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specified herein is subject to change for improvement without notice. the content specified herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specifications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when de signing circuits for mass production. great care was taken in ensuring the accuracy of the information specified in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no re- sponsibility for such damage. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the products. rohm does not grant you, explicitly or implicitly, any license to use or exer cise intellectual property or other rights held by rohm and other parties. rohm shall bear no re- sponsibility whatsoever for any dispute arising from the use of such technical information. the products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, elec- tronic ap pliances and amusement devices). the products are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possi bility of physical injury, fire or any other damage caused in the event of the failure of any product, such as derating, redundancy, fire control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which re quires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intend- ed to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specified herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.
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